Magnetoresistance effect element

ABSTRACT

A magnetoresistance effect element has a first ferromagnetic metal layer, a second ferromagnetic metal layer, and a tunnel barrier layer that is sandwiched between the first and second ferromagnetic metal layers, and the tunnel barrier layer has a spinel structure represented by a composition formula AGa2Ox (0&lt;x≤4), and an A-site is a non-magnetic divalent cation which is one or more selected from a group consisting of magnesium, zinc and cadmium.

This is a Continuation of application Ser. No. 15/554,066 filed Aug. 28, 2017, which is a National Stage Application of PCT/JP2016/060034 filed Mar. 29, 2016, which claims priority on Japanese Patent Application No. 2015-071411, filed on Mar. 31, 2015, the content of which is incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a magnetoresistance effect element.

BACKGROUND ART

Giant magnetoresistance (GMR) elements formed of a multilayer film consisting of a ferromagnetic layer and a non-magnetic layer, and tunnel magnetoresistance (TMR) elements using an insulating layer (a tunnel barrier layer or a barrier layer) as a non-magnetic layer have been known. In general, TMR elements have higher element resistance than GMR elements, but a magnetoresistance (MR) ratio of the TMR elements is higher than that of the GMR elements. The TMR elements can be divided into two types. One type is related to TMR elements using only a tunneling effect using an effect of soaking-out of a wave function between ferromagnetic layers. The other type is related to TMR elements using coherent tunneling using conduction in a specific orbit of a non-magnetic insulating layer where tunneling is carried out when the above-described tunneling effect is caused. TMR elements using coherent tunneling have been known to obtain a higher MR ratio than TMR elements using only tunneling. The coherent tunneling effect is caused in a case where both of the ferromagnetic layer and the non-magnetic insulating layer are crystalline and an interface between the ferromagnetic layer and the non-magnetic insulating layer is crystallographically continuous.

Magnetoresistance effect elements are used for various purposes. For example, magnetoresistance effect-type magnetic sensors have been known as magnetic sensors, and magnetoresistance effect elements determine characteristics of a reproducing function of hard disk drives. Magnetic sensors have a system that detects, as a resistance change of a magnetoresistance effect element, an effect that a magnetization direction of the magnetoresistance effect element is changed by an external magnetic field. Highly anticipated devices are magnetoresistance change-type random access memories (MRAM). MRAMs are memories that read magnetoresistance as digital signals of 0 and 1 by appropriately changing ferromagnetic magnetization directions of two layers to parallel or antiparallel directions.

LITERATURE Patent Documents

[Patent Document 1] Japanese Patent No. 5586028

[Patent Document 2] Japanese Unexamined Patent Application, First Publication No. 2013-175615

Non-Patent Documents

[Non Patent Document 1] Hiroaki Sukegawa, a [1] Huixin Xiu, Tadakatsu Ohkubo, Takao Furubayashi, Tomohiko Niizeki, Wenhong Wang, Shinya Kasai, Seiji Mitani, Koichiro Inomata, and Kazuhiro Hono, APPLIED PHYSICS LETTERS 96, 212505 [1] (2010)

[Non Patent Document 2] Thomas Scheike, Hiroaki Sukegawa, Takao Furubayashi, Zhenchao Wen, Koichiro Inomata, Tadakatsu Ohkubo, Kazuhiro Hono, and Seiji Mitani, Applied Physics Letters, 105, 242407 (2014)

[Non Patent Document 3] Yoshio Miura, Shingo Muramoto, Kazutaka Abe, and Masafumi Shirai, Physical Review B 86, 024426 (2012)

DISCLOSURE OF INVENTION Problem to be Solved by Invention

Information writing with spin-transfer torque (STT) has been brought to attention in the field of MRAM. The information to be written can be determined based on a direction of current by applying the current density by which the information is writable to a magnetic element. However, since the current for rewriting the information generally varies in accordance with the direction of the current which is applied to the magnetoresistance effect element, there is a problem that easy-to-rewrite level also varies in accordance with the information.

One of the factors causing the problem, i.e. the different easy-to-rewrite level of the information, is a MR ratio which varies according to a direction of current flowing the magnetoresistance effect element. In a case of STT, the easy-to-rewrite level is proportional to amplitude of the MR ratio. That is, the amount of current for rewriting the information varies as the MR ratio varies in accordance with the direction of the current. Therefore, the magnetoresistance effect element independent from the direction of current bias (i.e. with excellent symmetry for the current bias) is required as a MRAM or a switch. Moreover, in a case where the magnetoresistance effect element is used as a high-frequency oscillator or a wave detector, the magnetoresistance effect element independent from the direction of current bias is also required. The frequency stability is improved as the similarity for the current bias is enhanced in high-frequency applications.

In Patent Document 1 and Non Patent Document 1, a tunnel barrier having a spinel structure is reported to be effective as a substituent material for MgO. A spinel tunnel barrier expressed by a composition formula of MgAl₂O₄ has been known to obtain the same MgO ratio as MgO, and to obtain a higher MR ratio than MgO at a high bias voltage. In addition, in Patent Document 2 and Non Patent Documents 2 and 3, there is a description that MgAl₂O₄ is required to have a disordered spinel structure in order to obtain a high MR ratio. The disordered spinel structure mentioned herein refers to a cubic structure as a whole, in which the arrangement of O atoms has almost the same close-packed cubic lattice as a spinel, but the arrangements of Mg atoms and Al atoms are disordered. In an original spinel, Mg and Al are arranged with regularity in tetrahedral voids and octahedral voids of oxygen ions. However, since these are randomly arranged in a disordered spinel structure, the symmetry of crystal changes, and thus a structure in which the lattice constant is substantially reduced by half from about 0.808 nm of MgAl₂O₄ is obtained.

An object of the invention is to provide a magnetoresistance effect element which is able to effectively carry out the magnetization reversal due to the current and has more excellent symmetry of the MR ratio for the bias voltage compared with the TMR element using MgO, a conventional material of a tunnel barrier layer.

Means for Solving the Problems

In order to solve the above-described problems, a magnetoresistance effect element according to the invention has a first ferromagnetic metal layer, a second ferromagnetic metal layer, and a tunnel barrier layer that is sandwiched between the first and second ferromagnetic metal layers, and the tunnel barrier layer has a spinel structure represented by a composition formula AGa₂O_(x) (0<x≤4), in which A is a non-magnetic divalent cation which is one or more selected from a group consisting of magnesium, zinc and cadmium.

The spinel material containing potassium and oxygen exhibits a symmetric MR ratio regardless of the sign of the bias voltage, thus spin polarizablity is difficult to be attenuated at a region of low bias. Accordingly, the information is rewritable at the lower voltage than that of the conventional material.

In the magnetoresistance effect element, the tunnel barrier layer may have a lattice-matched portion that is lattice-matched with both of the first ferromagnetic metal layer and the second ferromagnetic metal layer, and a lattice-mismatched portion that is not lattice-matched with at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer.

In the magnetoresistance effect element, a volume ratio of the lattice-matched portion in the tunnel barrier layer with respect to a volume of the entire tunnel barrier layer may be 65% to 95%.

In a case where the volume ratio of the lattice-matched portion in the tunnel barrier layer is 65% or less, the effect of coherent tunneling is reduced, and thus the MR ratio decreases. In a case where the volume ratio of the lattice-matched portion in the tunnel barrier layer is 95% or greater, the interference effect between the spin-polarized electrons during passing through the tunnel barrier layer does not decrease, and thus an increase in passage of the spin-polarized electrons through the tunnel barrier layer is not observed. By making the number of constituent elements of the non-magnetic element smaller than half the number of elements of the aluminum ion, vacancies are generated in the cation sites, the vacancies and two or more types of non-magnetic elements occupy the cations, and thus lattice periodicity is disturbed. Accordingly, the MR ratio is further increased.

In the magnetoresistance effect element, the tunnel barrier layer may have a disordered spinel structure. In a case where the tunnel barrier layer is disordered, the MR ratio is increased.

In the magnetoresistance effect element, a crystal lattice of either or both of the first ferromagnetic metal layer and the second ferromagnetic metal layer may be matched with a crystal lattice of the tunnel barrier layer to form a cubic-on-cubic structure. The crystal lattice of the spinel material containing potassium and oxygen is matched with the crystal lattice of the ferromagnetic material such as iron, thereby forming the cubic-on-cubic structure. Therefore, since scattering at an interface between the tunnel barrier layer and the ferromagnetic metal layer is suppressed, bias dependency of the MR ratio exhibits a symmetric structure regardless of the direction of voltage. Accordingly, the information is rewritable at the lower voltage than that of the conventional material.

In the magnetoresistance effect element, a composition ratio of the divalent cation and the trivalent cation (Ga ion) may be within a range of 0.9 to 1.25:2. In a case where the composition ratio of the divalent cation and the trivalent cation is approximately 1:2, the structure is difficult to be disordered and thus bias symmetry of the MR ratio is improved. Accordingly, the information is rewritable at the lower current than that of the conventional material.

In the magnetoresistance effect element, the first ferromagnetic metal layer may have larger coercivity than the second ferromagnetic metal layer. Since the coercivity of the first ferromagnetic metal layer is different from that of the second ferromagnetic metal layer, the element functions as a spin valve, and device application is possible.

In the magnetoresistance effect element, a magnetoresistance ratio may be 100% or greater when applying the voltage of 1 V or higher at room temperature. Accordingly, the magnetoresistance effect element is available in devices to which the high bias voltage is applied, e.g. a high-sensitive magnetic sensor, a logic-in-memory and a MRAM.

In the magnetoresistance effect element, at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer may have magnetic anisotropy perpendicular to a lamination direction. Since it is not necessary to apply a bias magnetic field, it is possible to reduce the device in size. In addition, the element can be allowed to function as a recording element since it has high thermal disturbance resistance.

In the magnetoresistance effect element, at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer may be Co₂Mn_(1-a)Fe_(a)Al_(b)Si_(1-b) (0≤a≤1, 0≤b≤1). Co₂Mn_(1-a)Fe_(a)Al_(b)Si_(1-b) is a ferromagnetic metal material having high spin polarizability, and a higher MR ratio can be obtained than in a case where another ferromagnetic metal material is used.

Effects of the Invention

According to the invention, it is possible to provide a magnetoresistance effect element which is able to effectively carry out the magnetization reversal due to the current and has more excellent symmetry of the MR ratio for the bias voltage compared with the TMR element using MgO or MgAl₂O₄, conventional materials of the tunnel barrier layer.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 shows a lamination structure of a magnetoresistance effect element.

FIG. 2 is a diagram of a crystal structure of a spinel.

FIG. 3 is a schematic diagram of an ordered spinel structure and a disordered spinel structure with symmetry of Fm-3m having a lattice constant assumed in a tunnel barrier layer of the invention.

FIG. 4 is a schematic diagram of an ordered spinel structure and a disordered spinel structure with symmetry of Fm-3m having a lattice constant assumed in a tunnel barrier layer of the invention.

FIG. 5 is a schematic diagram of an ordered spinel structure and a disordered spinel structure with symmetry of Fm-3m having a lattice constant assumed in a tunnel barrier layer of the invention.

FIG. 6 is a schematic diagram of an ordered spinel structure and a disordered spinel structure with symmetry of F-43m having a lattice constant assumed in a tunnel barrier layer of the invention.

FIG. 7 is a schematic diagram of an ordered spinel structure and a disordered spinel structure with symmetry of F-43m having a lattice constant assumed in a tunnel barrier layer of the invention.

FIG. 8 is a diagram showing an evaluation structure of a magnetoresistance effect element according to an embodiment in a direction perpendicular to a lamination direction.

FIG. 9 is a diagram showing the element structure according to the embodiment in the lamination direction.

FIG. 10 is a diagram showing results of evaluation of a magnetoresistance effect of a magnetoresistance effect element of Example 1.

FIG. 11 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage of Example 1 as a reference.

FIG. 12 is a diagram showing results of evaluation of a magnetoresistance effect of a magnetoresistance effect element of Example 2.

FIG. 13 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage of Example 2 as a reference.

FIG. 14 is a diagram showing results of evaluation of a magnetoresistance effect of a magnetoresistance effect element of Example 3.

FIG. 15 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage of Example 3 as a reference.

FIG. 16 is a diagram showing results of evaluation of a magnetoresistance effect of a magnetoresistance effect element of Example 4.

FIG. 17 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage of Example 4 as a reference.

FIG. 18 is a diagram showing a maximum value of a reversal current and a concentration ratio of Mg to Ga in a case where a concentration of Ga is 2 in Example 5.

FIG. 19 is a diagram showing results of evaluation of a magnetoresistance effect of a magnetoresistance effect element of Comparative Example 1.

FIG. 20 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage of Comparative Example 1 as a reference.

FIG. 21 shows an example of a part in which the tunnel barrier layer and the ferromagnetic metal layer are lattice-matched. FIG. 21(a) shows a high-resolution cross-section TEM image. FIG. 21(b) shows an example of an image obtained by performing inverse Fourier analysis.

FIG. 22 is a diagram showing a structure of a cross-section including a direction parallel to a lamination direction of Example 8.

FIG. 23 is a diagram showing a proportion of a lattice-matched portion in which a tunnel barrier layer of Example 9 is lattice-matched with both of a first ferromagnetic metal layer and a second ferromagnetic metal layer, and characteristics of an element. FIG. 23(A) is a diagram showing element resistance (Rp) when magnetization directions of the first ferromagnetic metal layer and the second ferromagnetic metal layer are parallel to each other. FIG. 23(B) is a diagram showing element resistance (Rap) when magnetization directions of the first ferromagnetic metal layer and the second ferromagnetic metal layer are antiparallel to each other. FIG. 23(C) is a diagram showing a magnetoresistance ratio of the element.

EMBODIMENTS FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements will be denoted by the same reference numerals, and an overlapping description thereof will be omitted.

First Embodiment

Hereinafter, a case where a magnetoresistance effect element according to a first embodiment has a first ferromagnetic metal layer 6, a second ferromagnetic metal layer 7, and a tunnel barrier layer 3 sandwiched between the first and second ferromagnetic metal layers, and the tunnel barrier layer 3 has a spinel structure represented by a composition formula AGa₂O_(x) (0<x≤4), and A is a non-magnetic divalent cation which is one or more selected from a group consisting of magnesium, zinc and cadmium, will be described.

(Basic Structure)

In the example shown in FIG. 1, a magnetoresistance effect element 100 is provided on a substrate 1, and has a stacked structure provided with an underlayer 2, a first ferromagnetic metal layer 6, a tunnel barrier layer 3, a second ferromagnetic metal layer 7, and a cap layer 4 in order from the substrate 1.

(Tunnel Barrier Layer)

The tunnel barrier layer 3 is made of a non-magnetic insulating material. In general, the tunnel barrier layer has a film thickness of 3 nm or less, and in a case where the tunnel barrier layer is sandwiched between metal materials, a wave function of electrons of atoms of the metal materials extends beyond the tunnel barrier layer 3, and thus a current may flow regardless of the presence of an insulating material on the circuit. The magnetoresistance effect element 100 is classified into two types including: a type in which the typical tunneling effect is used; and a type in which the coherent tunneling effect where an orbit for tunneling is limited is predominant. In the typical tunneling effect, a magnetoresistance effect is obtained by spin polarization of ferromagnetic materials. On the other hand, in the coherent tunneling, an orbit for tunneling is limited. Therefore, in a magnetoresistance effect element in which coherent tunneling is predominant, an effect higher than or equivalent to spin polarization of ferromagnetic metal materials can be expected. In order to exhibit the coherent tunneling effect, it is necessary that the ferromagnetic metal materials and the tunnel barrier layer 3 be crystallized and joined in a specific orientation.

(Spinel Structure)

FIG. 2 shows a crystal structure of a spinel. An A-site in which oxygen is fourfold coordinated to cations and a B-site in which oxygen is sixfold coordinated to cations exist. Here, a Sukenel structure referring to the spinel structure in which cations are disordered is a structure that has a lattice constant half the lattice constant of an ordered spinel structure while a position of an oxygen atom of the ordered spinel is almost not changed, and in which cations are positioned in tetrahedral positions and octahedral positions of oxygen atoms that are not occupied under ordinary circumstances. At this time, this structure may include total five structures shown in FIGS. 3 to 7, and may be any one of them or a mixed structure thereof.

(Definition of Disordered Spinel Structure)

In this specification, the spinel structure in which cations are disordered may be referred to as a Sukenel structure. The Sukenel structure refers to a structure where oxygen atoms are arranged in cubic close-packed lattice that is substantially similar to spinel lattice, the structure as a whole belongs to a cubic structure, but arrangement of cations are disordered. In an original ordered spinel, Mg and Al are arranged in order in the tetrahedral vacancies and octahedral vacancies in the original spinel. However, since these are arranged in random arrangement in the Sukenel structure, the crystal symmetry of the structure is different from MgAl₂O₄, and the lattice constant of the structure is substantially half of that of MgAl₂O₄. With a change in the lattice-repeating unit, a combination between the ferromagnetic layer material and the electronic structure (band structure) is changed, and thus a large TMR enhancement due to a coherent tunneling effect is obtained. For example, a space group of MgAl₂O₄ that is a non-magnetic spinel material is Fd-3m, but a space group of a disordered spinel structure with a lattice constant reduced by half is known to be changed to Fm-3m or F-43m, and there are a total of five structures (Non-Patent Document 2). Any one of them can be used.

In this specification, the Sukenel structure is not essentially required to be a cubic structure. In the stacked structure, the crystal structure is influenced by the crystal structure of the material of an underlayer, and the lattice is thus partially distorted. Each material has a bulk crystal structure, but in a case where it is formed into a thin film, a partially distorted crystal structure based on the bulk crystal structure can be taken. Particularly, in the invention, the tunnel barrier layer has a very thin structure, and is easily influenced by the crystal structure of the layer brought into contact with the tunnel barrier layer. In this regard, the bulk crystal structure of a Sukenel structure is a cubic structure, and in this specification, the Sukenel structure includes a Sukenel structure which does not have a cubic structure in addition to a Sukenel structure slightly deviating from the cubic structure. A deviation from the cubic structure in the Sukenel structure described in this specification is generally slight, and this deviation depends on the accuracy of a measurement method for evaluating the structure.

The divalent cation (A-site) in the non-magnetic element of the tunnel barrier layer is one or more selected from the group consisting of magnesium, zinc, and cadmium. These non-magnetic elements are stable in a case where the number of valence is 2, and in a case where these non-magnetic elements are constituent elements of the tunnel barrier layer, coherent tunneling can be realized, and the MR ratio is increased.

In a case where the divalent cation (A-site) contained in the tunnel barrier layer includes a plurality of non-magnetic elements, a difference in ionic radius between the divalent cations of the plurality of non-magnetic elements is preferably 0.2 A or less. In a case where the difference in ionic radius is small, the cations are unlikely to be ordered, and thus the lattice constant becomes smaller than that of a general spinel structure. Accordingly, the MR ratio is further increased in a case of two or more types of elements that are similar to each other in ionic radius.

(First Ferromagnetic Metal Layer)

Examples of the material of the first ferromagnetic metal layer 6 include metal selected from the group consisting of Cr, Mn, Co, Fe, and Ni, alloy including one or more of the metals of the group, and alloy including one or more metals selected from the group and at least one element of B, C, and N. Specific examples thereof include Co—Fe and Co—Fe—B. A Heusler alloy such as Co₂FeSi is preferable in order to obtain a high output. The Heusler alloy includes intermetallic compounds having a chemical composition of X₂YZ. X denotes a Co, Fe, Ni, or Cu group transition metal element or noble metal in the periodic table, Y denotes a Mn, V, Cr, or Ti group transition metal, and can also take the elemental species of X, and Z denotes representative elements of III to V groups. Examples thereof include Co₂FeSi, Co₂MnSi, and Co₂Mn_(1-a)Fe_(a)Al_(b)Si_(1-b). In addition, an antiferromagnetic material such as IrMn and PtMn may be used as a material brought into contact with the first ferromagnetic metal layer 6 in order to make coercivity of the first ferromagnetic metal layer larger than that of the second ferromagnetic metal layer 7. Furthermore, the first ferromagnetic metal layer may have a synthetic ferromagnetic coupling structure such that the second ferromagnetic metal layer 7 is not influenced by a leakage magnetic field of the first ferromagnetic metal layer 6.

In a case where a magnetization direction of the first ferromagnetic metal layer 6 is made perpendicular to the stacked plane, a stacked film of Co and Pt is preferably used. For example, in a case where the first ferromagnetic metal layer 6 has a composition of [Co (0.24 nm)/Pt (0.16 nm)]₆/Ru (0.9 nm)/[Pt (0.16 nm)/Co (0.16 nm)]₄/Ta (0.2 nm)/FeB (1.0 nm), the magnetization direction can be made perpendicular to the stacked plane.

(Second Ferromagnetic Metal Layer)

A ferromagnetic material, particularly, a soft magnetic material is applied as a material of the second ferromagnetic metal layer 7, and examples thereof include metal selected from the group consisting of Cr, Mn, Co, Fe, and Ni, alloy including one or more of the metals of the group, and alloy including one or more metals selected from the group and at least one element of B, C, and N. Specific examples thereof include Co—Fe, Co—Fe—B, and Ni—Fe.

In a case where a magnetization direction of the second ferromagnetic metal layer 7 is made perpendicular to the stacked plane, the second ferromagnetic metal layer 7 preferably has a thickness of 2.5 nm or less. Perpendicular magnetic anisotropy can be applied to the second ferromagnetic metal layer 7 at an interface between the second ferromagnetic metal layer 7 and the tunnel barrier layer 3. The second ferromagnetic metal layer 7 preferably has a thin film thickness since the effect of the perpendicular magnetic anisotropy is reduced if the second ferromagnetic metal layer 7 has a thick film thickness.

In general, the first ferromagnetic metal layer 6 has a structure in which the magnetization direction thereof is fixed, and is called a fixed layer. In addition, since the second ferromagnetic metal layer 7 has a magnetization direction that can be more easily changed by an external magnetic field or a spin torque than the first ferromagnetic metal layer 6, the second ferromagnetic metal layer is called a free layer.

(Substrate)

A magnetoresistance effect element according to the invention may be formed on a substrate.

In that case, a material showing excellent flatness is preferably used as a material of the substrate 1. The substrate 1 differs depending on the purpose. For example, in a case of MRAM, a circuit formed in a Si substrate can be used under the magnetoresistance effect element. In a case of a magnetic head, an AlTiC substrate that can be easily processed can be used.

(Underlayer)

In a case where a magnetoresistance effect element according to the invention is formed on a substrate, first, an underlayer may be formed on the substrate.

In that case, the underlayer 2 is used to control crystallinity such as crystal orientation and crystal grain size of the first ferromagnetic metal layer 6 and layers formed above the first ferromagnetic metal layer 6. Therefore, it is important to select the material of the underlayer 2. Hereinafter, the material and the configuration of the underlayer 2 will be described. Any of a conductive material and an insulating material may be used for the underlayer, but in a case where electric power is fed to the underlayer, a conductive material is preferably used. First, as a first example of the underlayer 2, a nitride layer having a (001)-oriented NaCl structure and containing at least one element selected from the group consisting of Ti, Zr, Nb, V, Hf, Ta, Mo, W, B, Al, and Ce is exemplified. As a second example of the underlayer 2, a (002)-oriented perovskite conductive oxide layer made of RTO₃ is exemplified. Here, the R-site includes at least one element selected from the group consisting of Sr, Ce, Dy, La, K, Ca, Na, Pb, and Ba, and the T-site includes at least one element selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb. As a third example of the underlayer 2, an oxide layer having a (001)-oriented NaCl structure and containing at least one element selected from the group consisting of Mg, Al, and Ce is exemplified. As a fourth example of the underlayer 2, a layer having a (001)-oriented tetragonal or cubic structure and containing at least one element selected from the group consisting of Al, Cr, Fe, Co, Rh, Pd, Ag, Ir, Pt, Au, Mo, and W is exemplified. As a fifth example of the underlayer 2, a layer having a stacked structure with a combination of two or more of the layers of the above first to fourth examples is exemplified. By devising the structure of the underlayer as described above, it is possible to control the crystallinity of the ferromagnetic layer 2 and layers formed above the ferromagnetic layer 2, thereby improving the magnetic characteristics.

(Cap Layer)

A cap layer may be formed on the second ferromagnetic metal layer of the magnetoresistance effect element according to the invention.

A cap layer 4 is installed above the second ferromagnetic metal layer 7 in a stacking direction in order to control crystallinity such as crystal orientation and crystal grain size and element diffusion. In a case where a free layer having a bcc structure is formed, the crystal structure of the cap layer may be any one of a fcc structure, a hcp structure, and a bcc structure. In a case where a free layer having a fcc structure is formed, the crystal structure of the cap layer may be any one of a fcc structure, a hcp structure, and a bcc structure. The film thickness of the cap layer may be within such a range that a distortion relaxation effect is obtained and a reduction in the MR ratio by shunt is not shown. The film thickness of the cap layer is preferably 1 nm to 30 nm.

(Shape and Dimensions of Element)

A laminate formed of the first ferromagnetic metal layer, the tunnel barrier layer, and the second ferromagnetic metal layer 2 constituting the invention has a columnar shape. In addition, it may have various shapes such as a circular shape, a square shape, a triangle shape, and a polygonal shape when viewed from top, and preferably has a circular shape from the viewpoint of symmetry. That is, the laminate preferably has a columnar shape.

FIGS. 8 and 9 show examples of the shape and the dimensions of the magnetoresistance effect element.

FIG. 8 is a diagram showing a structure when viewed from a side in a stacking direction of the magnetoresistance effect element 100. The magnetoresistance effect element 100 of FIG. 8 has an electrode layer 5 formed above the cap layer 4 shown in FIG. 1. FIG. 9 is a diagram showing a structure when viewed in the stacking direction of the magnetoresistance effect element 100. In FIG. 9, a current source 71 and a voltmeter 72 are also shown.

The magnetoresistance effect element 100 is processed into a columnar shape of 80 nm or less as shown in FIGS. 8 and 9, and wiring is applied. Since the magnetoresistance effect element 100 is processed into a columnar shape having a size of 80 nm or less, a domain structure is not likely to be formed in the ferromagnetic metal layers, and it is not necessary to consider a component having a different spin polarization in the ferromagnetic metal layers In FIG. 9, the magnetoresistance effect element 100 is disposed at a position where the underlayer 2 and the electrode layer 5 intersect each other.

(Evaluation Method)

The magnetoresistance effect element 100 can be evaluated with the structure shown in FIGS. 8 and 9. For example, the power supply 71 and the voltmeter 72 are disposed as shown in FIG. 9 such that a fixed current or a fixed voltage is applied to the magnetoresistance effect element 100. By measuring the voltage or the current while sweeping an external magnetic field, a change in the resistance of the magnetoresistance effect element 100 can be measured.

In general, the MR ratio is expressed by the following formula.

MR Ratio (%)={(R _(AP) −R _(P))/R _(P)}×100

R_(P) denotes a resistance in a case where magnetization directions of the first ferromagnetic metal layer 6 and the second ferromagnetic metal 7 are parallel to each other, and R denotes a resistance in a case where magnetization directions of the first ferromagnetic metal layer 6 and the second ferromagnetic metal 7 are antiparallel to each other.

In a case where a strong current flows in the magnetoresistance effect element 100, magnetization rotation occurs by a STT effect, and a resistance value of the magnetoresistance effect element 100 is rapidly changed. The current value at which the resistance value is rapidly changed is called a reversal current value (Jc).

(Others)

In this embodiment, the structure has been exemplified in which the first ferromagnetic metal layer 6 having high coercivity is disposed on the lower side, but the invention is not limited to this structure. In a case of a structure in which the first ferromagnetic metal layer 6 having high coercivity is disposed on the upper side, the coercivity is reduced in comparison with a case in which the first ferromagnetic metal layer 6 is disposed on the lower side, but the tunnel barrier layer 3 can be formed by utilizing the crystallinity of the substrate, and thus the MR ratio can be increased.

In order to utilize the magnetoresistance effect element as a magnetic sensor, a resistance change preferably changes linearly with respect to an external magnetic field. In a general laminated film of ferromagnetic layers, magnetization directions are easily directed into the lamination plane by shape anisotropy. In this case, for example, a magnetic field is applied from outside to make the magnetization directions of the first ferromagnetic metal layer and the second ferromagnetic metal layer intersect each other, thereby changing the resistance change linearly with respect to the external magnetic field. However, in this case, since a mechanism that applies a magnetic field is required near the magnetoresistance effect element, this is not preferable for integration. In a case where the ferromagnetic metal layer itself has perpendicular magnetic anisotropy, this is advantageous for integration since a method such as application of a magnetic field from outside is not required.

The magnetoresistance effect element using this embodiment can be used as a magnetic sensor or a memory such as a MRAM. Particularly, this embodiment is effective for products that are used with a bias voltage higher than a bias voltage used in conventional magnetic sensors.

(Manufacturing Method)

The magnetoresistance effect element 100 can be formed using, for example, a magnetron sputtering apparatus.

The tunnel barrier layer 3 can be produced through a known method. For example, a thin metal film is formed on the first ferromagnetic metal layer 6 by sputtering, performing plasma oxidation or natural oxidation by oxygen introduction thereon, and performing a heat treatment thereon. As the film-forming method, not only a magnetron sputtering method but also a thin film-forming method such as a vapor deposition method, a laser ablation method, or a MBE method can be used.

Each of the underlayer, the first ferromagnetic metal layer, the second ferromagnetic metal layer, and the cap layer can be formed through a known method.

Second Embodiment

A second embodiment is different from the first embodiment only in the method of forming a tunnel barrier layer. In the first embodiment, the tunnel barrier layer is formed by repeatedly performing formation and oxidation of a metal film. In the second embodiment, the substrate temperature is lowered to −70 to −30 degrees, and then oxidation is performed in the oxidation step. By cooling the substrate, a temperature gradient is generated between the substrate and the vacuum or between the substrate and the plasma. First, in a case where a surface of the substrate is exposed to oxygen, oxygen reacts with the metal material and the metal material is oxidized. However, the oxidation does not proceed due to the low temperature. Accordingly, the oxygen amount of the tunnel barrier layer is easily adjusted. Moreover, by forming the temperature gradient, epitaxial growth (lattice-matched growth) is easily adjusted. Since the crystal growth proceeds by the temperature gradient, the epitaxial growth is easily performed in a case where the temperature of the substrate is sufficiently lowered. As the temperature of the substrate is increased, domains are formed and a plurality of crystal nuclei are thus formed in the plane. Each of the crystal nuclei is independently and epitaxially grown, and thus a part in which lattices are not matched is formed in a part in which the grown domains are in contact with each other.

It is preferable that in the tunnel barrier layer, lattice-matched; parts, which are lattice-matched with both of a first ferromagnetic metal layer and a second ferromagnetic metal layer, partially exist. In general, it is preferable that the tunnel barrier layer be completely lattice-matched to both of the first ferromagnetic metal layer and the second ferromagnetic metal layer. However, in a case where the tunnel barrier layer is completely lattice-matched, spin-polarized electrons interfere with each other during passing through the tunnel barrier layer, and thus the electrons do not easily pass through the tunnel barrier layer. In contrast, in a case where lattice-matched parts, in which lattices are matched, partially exist, the interference between spin-polarized electrons during passing through the tunnel barrier layer is appropriately cut in parts in which lattices are not matched, and thus the spin-polarized electrons easily pass through the tunnel barrier layer. The volume ratio of the lattice-matched part portion in the tunnel barrier layer with respect to the volume of the entire tunnel barrier layer is preferably 65% to 95%. In a case where the volume ratio of the lattice-matched part in the tunnel barrier layer is 65% or less, the effect of coherent tunneling is reduced, and thus the MR ratio decreases. In a case where the volume ratio of the lattice-matched part in the tunnel barrier layer is 95% or greater, the interference effect between the spin-polarized electrons during passing through the tunnel barrier layer is not be weakened, and thus an increase in passage of the spin-polarized electrons through the tunnel barrier layer is not observed.

(Method of Calculating Volume Ratio of Lattice-Matched Portion)

The volume ratio of the lattice-matched part (lattice-matched portion) with respect to the volume of the entire tunnel barrier layer can be estimated from, for example, a TEM image. Regarding whether the lattices are matched, a part including the tunnel barrier layer, the first ferromagnetic metal layer, and the second ferromagnetic metal layer in a cross-section TEM image is Fourier-transformed to obtain an electron beam diffraction image. In the electron beam diffraction image obtained by Fourier transformation, electron beam diffraction spots in directions other than the stacking direction are removed. That image is subjected to inverse Fourier transformation to provide an image in which information only in the stacking direction is obtained. In lattice lines in the inverse Fourier image, a part in which the tunnel barrier layer is continuously connected to both of the first ferromagnetic metal layer and the second ferromagnetic metal layer is defined as a lattice-matched portion. In addition, in lattice lines, a part in which the tunnel barrier layer is not continuously connected to at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer, or in which no lattice lines are detected, is defined as a lattice-mismatched portion. In the lattice-matched portion, in the lattice lines in the inverse Fourier image, the layers are continuously connected from the first ferromagnetic metal layer to the second ferromagnetic metal layer via the tunnel barrier layer, and thus a width (L_(C)) of the lattice-matched portion can be measured from the TEM image. Similarly, in the lattice-mismatched portion, in the lattice lines in the inverse Fourier image, the layers are not continuously connected, and thus a width (L_(I)) of the lattice-mismatched portion can be measured from the TEM image. Using the width (L_(C)) of the lattice-matched portion as a numerator and using the sum of the width (L_(C)) of the lattice-matched portion and the width (L_(I)) of the lattice-mismatched portion as a denominator, the volume ratio of the lattice-matched portion with respect to the volume of the entire tunnel barrier layer can be obtained. The TEM image is a cross-section image, but includes information including a depth. Accordingly, it can be thought that the region estimated from the TEM image is proportional to the volume.

FIG. 21 shows an example of the part in which the tunnel barrier layer and the ferromagnetic metal layer are lattice-matched. FIG. 21 (A) shows an example of a high-resolution cross-section TEM image. FIG. 21 (B) shows an example of an image obtained by performing inverse Fourier transformation after removal of electron beam diffraction spots in directions other than the stacking direction in the electron beam diffraction image. In FIG. 21 (B), components perpendicular to the stacking direction are removed, and thus lattice lines can be observed in the stacking direction. This shows that the tunnel barrier layer and the ferromagnetic metal layer are continuously connected to each other without interruption at an interface therebetween.

EXAMPLES Example 1

Hereinafter, an example of the method of manufacturing a magnetoresistance effect element according to the first embodiment will be described. Film formation was performed on a substrate provided with a thermal silicon oxide film using a magnetron sputtering method. As an underlayer, 5 nm of Ta/3 nm of Ru was formed, and as a first ferromagnetic metal layer, [Co (0.24 nm)/Pt (0.16 nm)]₆/Ru (0.9 nm)/[Pt (0.16 nm)/Co (0.16 nm)]₄/Ta (0.2 nm)/FeB (1.0 nm) was formed in order thereon. Next, a method of forming a tunnel barrier layer will be shown. A 0.5 nm thick film of MgGa₂ is formed by sputtering with a target having an alloy composition of MgGa₂. Thereafter, the above-described sample was moved to an oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation by introducing Ar and oxygen. The natural oxidation time was 10 seconds, the partial pressure ratio of Ar to oxygen was 1 to 25, and the total gas pressure was 0.05 Pa. Then, the sample was returned to a film forming chamber, and a film of MgGa₂ with a thickness of 0.4 m was formed. The above-described sample was moved to the oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation and inductively coupled plasma oxidation by introducing Ar and oxygen. The natural oxidation time was 30 seconds, and the inductively coupled plasma oxidation time was 5 seconds. The partial pressure ratio of Ar to oxygen was 1 to 20, and the total gas pressure was 0.08 Pa.

The above-described stacked film was moved again to the film forming chamber, and a 2 nm thick FeB film was formed as a second ferromagnetic metal layer 7. 3 nm of Ru/5 nm of Ta was formed as a cap layer 4.

The above-described stacked film was installed in an annealing apparatus, and treated for 10 minutes at a temperature of 450° C. in Ar. Then, in a state in which a magnetic field of 8 kOe was applied, the stacked film was heated at a temperature of 280° C. for 6 hours.

Next, an element was formed as in FIG. 9. First, a photoresist was formed using electron beam lithography in such a way that the electrode layer was in a direction rotated by 90 degrees as in FIG. 9. A part other than a part below the photoresist was eliminated by an ion milling method to expose the thermal silicon oxide film that was the substrate, and thus a shape of the underlayer 2 was formed. In a narrow part in the shape of the underlayer, a photoresist was formed into a cylindrical shape of 80 nm using electron beam lithography, and a part other than a part below the photoresist was eliminated by an ion milling method to expose the underlayer. Thereater, SiOx was formed as an insulating layer on the part shaved by ion milling. Here, the photoresist with a cylindrical shape of 80 nm was removed. The photoresist was not formed only in a part corresponding to an electrode pad of FIG. 9, and the insulating layer was removed by an ion milling method to expose the underlayer. Thereafter, an Au layer was formed. This electrode pad 8 functions as a contact electrode for the underlayer of the above-described stacked film. Next, a photoresist was formed and shaping was performed by an ion milling method such that the electrode layer of FIG. 9 was formed, and an Au film was formed. This functions as a contact electrode for the electrode layer of the above-described stacked film.

(Characteristics of Example 1)

The magnetoresistance effect element evaluation method is based on a magnetoresistance effect element evaluation method that has been generally performed. As shown in FIG. 9, a current source and a voltmeter were connected to the electrode pad and the electrode layer, respectively, to perform measurement by a four-terminal method. FIG. 10 is a diagram showing results of evaluation of the magnetoresistance effect of the magnetoresistance effect element of Example 1. The horizontal axis represents an applied current, and the vertical axis represents the resistance of the element. The current was applied from a current source to the magnetoresistance effect element to measure the voltage. In FIG. 10, resistance values were calculated and plotted in terms of a correlation between the current and the voltage. The current flowing from the second ferromagnetic metal layer to the first ferromagnetic metal layer was determined as a current flowing in the positive direction, while the current flowing reversely was determined as a current flowing in the negative direction. Moreover, the evaluation was performed in a state where the element resistance was rapidly changed by increasing the current and thus the current gradually changed to a current opposite to the direction thereof and reducing the current by a current value in which magnetization directions of the first and second ferromagnetic metal layers were varied from parallel to antiparallel or vice versa. The direction of an arrow shown in FIG. 10 indicates the order in which the element resistance was changed. From FIG. 10, it was recognized that the resistance was rapidly increased with the current of 1 mA and rapidly decreased with the current of −1.05 mA. Therefore, the reversal current values are 1 mA and −1.05 mA, respectively. Based on these results, it was found that the magnetization directions of the first and second ferromagnetic metal layers were gradually changed due to the STT effect occurred by the current and thus the element resistance was changed. It was also found that the area resistance (RA) was 0.6 Ω·μm² in a case where the magnetization directions of the first and second ferromagnetic metal layers were parallel to each other. The MR ratio was 64.8% in a case where the bias voltage was 1 V. This tunnel barrier layer was confirmed as a spinel structure consisting of a cubic structure from an electron beam diffraction image.

The MR ratio was calculated using the results shown in FIG. 10. FIG. 11 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage as a reference. In the drawing, the horizontal axis represents an applied current, and the vertical axis represents a decreasing rate of the MR ratio on the basis of the MR ratio in a case where the bias voltage of 0.001 V was applied. From FIG. 11, it was found that the voltage (V_(half)) at which the MR ratio decreased by half was 1.05 V or −1 V. V_(half) is one of the indices indicating decrease in the MR ratio under the bias voltage. V_(half) represents a bias voltage at which the MR ratio decreases by half compared with the MR ratio at the time when the low bias voltage was applied on the basis of the low bias voltage as a reference. The low bias voltage is, for example, 1 mV. Furthermore, since the optimal low bias voltage varies according to the conditions such as the resistance value of the magnetoresistance effect element, it is needed that the low bias voltage is at least a voltage equal to or less than a tenth part of V_(half).

Example 2

The production method is similar to that in the Example, but only the material for forming the tunnel barrier layer is different from that of Example. A 0.5 nm thick film of ZnGa₂ is formed by sputtering with a target having an alloy composition of ZnGa₂. Thereafter, the above-described sample was moved to an oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation by introducing Ar and oxygen. The natural oxidation time was 10 seconds, the partial pressure ratio of Ar to oxygen was 1 to 25, and the total gas pressure was 0.05 Pa. Then, the sample was returned to a film forming chamber, and a film of ZnGa₂ with a thickness of 0.4 nm was formed. The above-described sample was moved to the oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation and inductively coupled plasma oxidation by introducing Ar and oxygen. The natural oxidation time was 30 seconds, and the inductively coupled plasma oxidation time was 5 seconds. The partial pressure ratio of Ar to oxygen was 1 to 20, and the total gas pressure was 0.08 Pa.

(Characteristics of Example 2)

FIG. 12 is a diagram showing results of evaluation of the magnetoresistance effect of the magnetoresistance effect element of Example 2. From FIG. 12, it was recognized that the resistance was rapidly increased with the current of 1.2 mA and rapidly decreased with the current of −1.3 mA. Therefore, the reversal current values are 1.2 mA and −1.3 mA, respectively. It was also found that the area resistance (RA) was 0.64 Ω·μm² in a case where the magnetization directions of the first and second ferromagnetic metal layers were parallel to each other. The MR ratio was 50.9% in a case where the bias voltage was 1 V. This tunnel barrier layer was confirmed as a spinel structure consisting of a cubic structure from an electron beam diffraction image.

The MR ratio was calculated using the results shown in FIG. 12. FIG. 13 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage as a reference. In the drawing, the horizontal axis represents an applied current, and the vertical axis represents a decreasing rate of the MR ratio on the basis of the MR ratio in a case where the bias voltage of 0.001 V was applied. From FIG. 13, it was found that the voltage (V_(half)) at which the MR ratio decreased by half was 1.0 V or −0.9 V

Example 3

The production method is similar to that in the Example 1, but only the material for forming the tunnel barrier layer is different from that of Example 1. A 0.5 nm thick film of CdGa₂ is formed by sputtering with a target having an alloy composition of CdGa₂. Thereafter, the above-described sample was moved to an oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation by introducing Ar and oxygen. The natural oxidation time was 10 seconds, the partial pressure ratio of Ar to oxygen was 1 to 25, and the total gas pressure was 0.05 Pa. Then, the sample was returned to a film forming chamber, and a film of CdGa₂ with a thickness of 0.4 nm was formed. The above-described sample was moved to the oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation and inductively coupled plasma oxidation by introducing Ar and oxygen. The natural oxidation time was 30 seconds, and the inductively coupled plasma oxidation time was 5 seconds. The partial pressure ratio of Ar to oxygen was 1 to 20, and the total gas pressure was 0.08 Pa.

(Characteristics of Example 3)

FIG. 14 is a diagram showing results of evaluation of the magnetoresistance effect of the magnetoresistance effect element of Example 3. From FIG. 14, it was recognized that the resistance was rapidly increased with the current of 1.5 mA and rapidly decreased with the current of −1.5 mA. Therefore, the reversal current values are ±1.5 mA, respectively. It was also found that the area resistance (RA) was 0.67 Ω·μm² in a case where the magnetization directions of the first and second ferromagnetic metal layers were parallel to each other.

The MR ratio was calculated using the results shown in FIG. 14. FIG. 15 is a diagram showing a decreasing rate of the MR ratio at the bias voltage on the basis of the MR ratio at the low bias voltage as a reference. In the drawing, the horizontal axis represents a bias voltage, and the vertical axis represents a decreasing rate of the MR ratio on the basis of the MR ratio in a case where the bias voltage of 0.001 V was applied. From FIG. 15, it was found that the voltage (V_(half)) at which the MR ratio decreased by half was 1.1 V or −1.1 V. Moreover, a cross-section of the element was observed using an electron beam transmission apparatus to evaluate the tunnel barrier layer, the first ferromagnetic metal layer and the second ferromagnetic metal layer, respectively, with the electron beam diffraction. This tunnel barrier layer was confirmed as a spinel structure consisting of a cubic structure from an electron beam diffraction image. Furthermore, it was also confirmed that the cubic-on-cubic structure was formed since any of the tunnel barrier layer, the first ferromagnetic metal layer and the second ferromagnetic metal layer shared the same direction of the basic lattice.

Example 4

The production method is similar to that in the Example 1, but only the material for forming the tunnel barrier layer is different from that of Example 1. A film of 0.05 nm thick Mg/0.4 nm thick Mg_(0.5)Ga₂ was formed by sputtering with a target of Mg and a target of an alloy composition of Mg_(0.5)Ga₂. Thereafter, the above-described sample was moved to an oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation by introducing Ar and oxygen. The natural oxidation time was 10 seconds, the partial pressure ratio of Ar to oxygen was 1 to 25, and the total gas pressure was 0.05 Pa. Then, the sample was returned to a film forming chamber, and a film of 0.05 nm thick Mg/0.4 nm thick Mg_(0.5)Ga₂ was formed. The above-described sample was moved to the oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation and inductively coupled plasma oxidation by introducing Ar and oxygen. The natural oxidation time was 30 seconds, and the inductively coupled plasma oxidation time was 5 seconds. The partial pressure ratio of Ar to oxygen was 1 to 20, and the total gas pressure was 0.08 Pa.

(Characteristics of Example 4)

FIG. 16 is a diagram showing results of evaluation of the magnetoresistance effect of the magnetoresistance effect element of Example 4. From FIG. 16, it was recognized that the resistance was rapidly increased with the current of 0.8 mA and rapidly decreased with the current of −1.2 mA. Therefore, the reversal current values are 0.8 mA and −1.2 mA, respectively. It was also found that the area resistance (RA) was 0.56 Ω·μm² in a case where the magnetization directions of the first and second ferromagnetic metal layers were parallel to each other.

The MR ratio was calculated using the results shown in FIG. 16. FIG. 17 is a diagram showing a decreasing rate of the MR ratio at the applied voltage on the basis of the MR ratio at the low bias voltage as a reference. In the drawing, the horizontal axis represents a bias voltage, and the vertical axis represents a decreasing rate of the MR ratio on the basis of the MR ratio in a case where the bias voltage of 0.001 V was applied. From FIG. 17, it was found that the voltage (V_(half)) at which the MR ratio decreased by half was 1.1 V or −0.8 V. The MR ratio was 108% in a case where the bias voltage was 1V

(Composition and Structure Analyses of Example 4)

By comparing relative amounts using EDS, Mg:Ga was confirmed as 0.81:2. Structure analysis of the tunnel barrier layer was evaluated with an electron diffraction image obtained using a transmission electron microscope. Through this method, the structure of the barrier layer was examined, and it was confirmed that there was no reflection from the {022} plane and the {111} plane shown in the ordered spinel structure. In addition, it was found that this barrier had a cubic structure in which the spinel structure was disordered.

Example 5

The production method is similar to that in the Example 1, but only the material for forming the tunnel barrier layer is different from that of Example 1. A film of Mg_(x)Ga₂O₄ was formed by sputtering with a target of Mg and a target of an alloy composition of Mg_(0.5)Ga_(z).

(Characteristics of Example 5)

The reversal current value was evaluated based on the measurement results of the magnetoresistance effect. Moreover, the ratio of Mg and Ga was obtained using EDS. FIG. 18 is a diagram showing a maximum value of the reversal current and a concentration ratio of Mg to Ga in a case where a concentration of Ga is 2 in Example 5. From FIG. 18, it was found that the maximum value of the reversal current was the lowest in a case where a composition ratio of Mg was 0.9 to 1.25 when a concentration of Ga is 2.

Example 6

The production method is similar to that in Example 1, but only the method for forming the tunnel barrier layer is different from that of Example 1. Film formation was performed on a substrate provided with a thermal silicon oxide film using a magnetron sputtering method. As an underlayer, 5 nm of Ta/3 nm of Ru was formed, and as a first ferromagnetic metal layer, [Co (0.24 nm)/Pt (0.16 nm)]₆/Ru (0.9 nm)/[Pt (0.16 nm)/Co (0.16 nm)]₄/Ta (0.2 nm)/FeB (1.0 nm) was formed in order thereon. Next, a method of forming a tunnel barrier layer will be shown. A 0.5 nm thick film of MgGa₂ is formed by sputtering with a target having an alloy composition of MgGa₂. Thereafter, the above-described sample was moved to an oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less, and the substrate was cooled to −70 to −30 degrees. Then, natural oxidation was performed by introducing Ar and oxygen. The natural oxidation time was 10 seconds, the partial pressure ratio of Ar to oxygen was 1 to 25, and the total gas pressure was 0.05 Pa. Then, the sample was returned to a film forming chamber, and a film of MgGa₂ with a thickness of 0.4 m was formed. The above-described sample was moved to the oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less, and the substrate was cooled to −70 to −30 degrees. Then, natural oxidation and inductively coupled plasma oxidation were performed by introducing Ar and oxygen. The natural oxidation time was 30 seconds, and the inductively coupled plasma oxidation time was 5 seconds. The partial pressure ratio of Ar to oxygen was 1 to 20, and the total gas pressure was 0.08 Pa.

(Cross-Section Analysis of Example 6)

A volume ratio of the lattice-matched part (lattice-matched portion) with respect to the volume of the entire tunnel barrier layer was calculated as described above using a cross-section transmission electron microscope (TEM) image and an image obtained by removing electron beam diffraction spots in a direction other than a stacking direction in an electron beam diffraction image obtained by Fourier-transforming the TEM image and by then performing inverse Fourier transformation.

FIG. 22 is a structural schematic diagram of a cross-section including a direction parallel to the stacking direction of Example 6. From the high-resolution cross-section TEM image obtained in Example 6, it was found that a size (width) of the film surface of the lattice-matched part of the tunnel barrier layer in a direction parallel thereto was 30 nm or less in any part. 30 nm is about 10 times the lattice constant of the CoFe alloy that is the material of the first ferromagnetic metal layer and the second ferromagnetic metal layer, and mutual interference of the spin-polarized electrons in a direction perpendicular to the tunneling direction before or after coherent tunneling can be thought to be intensified about 10 times the lattice constant.

FIG. 23 is a diagram showing the volume ratio of the lattice-matched part (lattice-matched portion) with respect to the volume of the entire tunnel barrier layer of Example 6 and characteristics of the element. FIG. 23(a) is a diagram showing element resistance (Rp) when magnetization directions of the first ferromagnetic metal layer and the second ferromagnetic metal layer are parallel to each other. FIG. 23(b) is a diagram showing element resistance (Rap) when magnetization directions of the first ferromagnetic metal layer and the second ferromagnetic metal layer are antiparallel to each other. FIG. 23(c) is a diagram showing a magnetoresistance ratio of the element. The Rp tends to be reduced when the proportion of the lattice-matched part in which the tunnel barrier layer is lattice-matched to both of the first ferromagnetic metal layer and the second ferromagnetic metal layer is in the range of 65% to 95%. Regarding this, in a case where the tunnel barrier layer is completely lattice-matched, spin-polarized electrons interfere with each other while passing through the tunnel barrier layer, and thus it is thought that the electrons do not easily pass through the tunnel barrier layer. In contrast, in a case where the lattice-matched parts in which lattices are matched partially exists, the interference of spin-polarized electrons during passing through the tunnel barrier layer is appropriately cut in a part in which lattices are not matched, and thus the spin-polarized electrons easily pass through the tunnel barrier layer. As a result, it is thought that a tendency of a reduction in the Rp is observed. At the same time, a tendency of a slight increase in the Rap is observed when the proportion of the lattice-matched portion is in the range of 65% to 95%. This indicates that even when the magnetization directions of the first ferromagnetic metal layer and the second ferromagnetic metal layer are antiparallel to each other, the interference between domains is eased, and it is found that the spin-polarized electrons passing through the tunnel barrier layer are magnetically scattered.

Comparative Example 1

The production method is similar to that in Example 1, but only the material for forming the tunnel barrier layer is different that of Example 1. A 0.45 nm thick Mg film was formed by sputtering with a Mg target. Thereafter, the above-described sample was moved to an oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation by introducing Ar and oxygen. The natural oxidation time was 10 seconds, the partial pressure ratio of Ar to oxygen was 1 to 25, and the total gas pressure was 0.05 Pa. Then, the sample was returned to a film-forming chamber, and a film of Mg with a thickness of 0.4 nm was formed. Furthermore, the above-described sample was moved to the oxidation chamber of which the inside was kept in an ultrahigh vacuum of 1×10⁻⁸ Pa or less to perform natural oxidation and inductively coupled plasma oxidation by introducing Ar and oxygen. The natural oxidation time was 30 seconds, and the inductively coupled plasma oxidation time was 5 seconds. The partial pressure ratio of Ar to oxygen was 1 to 20, and the total gas pressure was 0.08 Pa.

(Characteristics of Comparative Example 1)

FIG. 19 is a diagram showing results of evaluation of a magnetoresistance effect of a magnetoresistance effect element of Comparative Example 1. From FIG. 19, it was recognized that the resistance was rapidly increased with the current of 2.5 mA and rapidly decreased with the current of −5 mA. Therefore, the reversal current values are 2.5 mA and −5 mA, respectively. It was also found that the area resistance (RA) was 0.64 Ω·μm² in a case where the magnetization directions of the first and second ferromagnetic metal layers were parallel to each other.

The MR ratio was calculated using the results shown in FIG. 19. FIG. 20 is a diagram showing a decreasing rate of the MR ratio at the applied voltage on the basis of the MR ratio at the low bias voltage of Comparative Example 1 as a reference. In the drawing, the horizontal axis represents a bias voltage, and the vertical axis represents a decreasing rate of the MR ratio on the basis of the MR ratio in a case where the bias voltage of 0.001 V was applied. From FIG. 20, it was found that the voltage (V_(half)) at which the MR ratio decreased by half was 0.45 V or −0.2 V. The MR ratio was 27% in a case where the bias voltage was 1 V.

(Comparison of Examples with Comparative Examples)

Table 1 shows the examples and the comparative examples.

TABLE 1 RA MR Ratio EXAMPLES [Ω · μm²] [%@ 1 V] V_(half) [V] Jc [mA] EXAMPLE 1 0.6 64.8 1.05-1    1.0-1.05 EXAMPLE 2 0.64 50.9   1-0.9 1.2-1.3 EXAMPLE 3 0.67 51 ±1.0 ±1.5 EXAMPLE 4 0.56 108 1.1-0.8 0.8-1.2 COMPARATIVE EXAMPLES COMPARATIVE 0.59 27 0.45-0.2  2.5-5   EXAMPLES 1

Comparison of Examples and Comparative Examples shows that any of MR ratio, V_(half) and Jc is better for Examples. In Example 4, the reversal current values are 0.8 mA and −1.2 mA, respectively. The reversal current is low in a case where the current flows in the positive direction. However, it is preferable that the information is rewritten with the same current value when rewriting information in the device in terms of the design. That is, the element of Example 4 needs a current of at least 1.2 mA or larger for rewriting the information. Accordingly, the reversal current value of the device becomes lower in a case where a composition ratio of Mg is 0.9 to 1.25 when a concentration of Ga is 2.

INDUSTRIAL APPLICABILITY

This invention is possible to apply to a magnetoresistance effect element which is able to effectively carry out the magnetization reversal due to the current and has more excellent symmetry of the MR ratio for the bias voltage compared with the TMR element using MgO, a conventional tunnel barrier layer.

DESCRIPTION OF THE REFERENCE SYMBOLS

-   -   100: MAGNETORESISTANCE EFFECT ELEMENT     -   1: SUBSTRATE     -   2: UNDERLAYER     -   3: TUNNEL BARRIER LAYER     -   4: CAP LAYER     -   5: ELECTRODE LAYER     -   6: FIRST FERROMAGNETIC METAL LAYER     -   7: SECOND FERROMAGNETIC METAL LAYER     -   8: ELECTRODE PAD     -   71: CURRENT SOURCE     -   72: VOLTMETER 

1. A magnetoresistance effect element comprising: a first ferromagnetic metal layer; a second ferromagnetic metal layer; and a tunnel barrier layer that is sandwiched between the first and second ferromagnetic metal layers, wherein the tunnel barrier layer has a spinel structure represented by a composition formula AGa₂O_(x) (0<x≤4), and an A-site is a non-magnetic divalent cation which is one or more selected from a group consisting of magnesium, zinc and cadmium, and wherein the tunnel barrier layer comprises: at least one lattice-matched portion that is lattice-matched with both of the first ferromagnetic metal layer and the second ferromagnetic metal layer; and at least one lattice-mismatched portion that is not lattice-matched with at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer, and when viewed as an inverse Fourier transform image in a stacking direction of a cross-sectional crystal lattice image of the interface between the tunnel barrier layer and the first and/or the second ferromagnetic metal layer, a lattice-matched portion is made up of a plurality of sequential, continuously-connected lattice lines, and a lattice-mismatched portion is made up of a plurality of sequential, non-continuously-connected lattice lines and/or no lattice lines.
 2. The magnetoresistance effect element according to claim 1, wherein a volume ratio of the lattice-matched portion with respect to a volume of the entire tunnel barrier layer is 65% to 95%.
 3. The magnetoresistance effect element according to claim 1, wherein the tunnel barrier layer has a disordered spinel structure.
 4. The magnetoresistance effect element according to claim 1, wherein a crystal lattice of either or both of the first ferromagnetic metal layer and the second ferromagnetic metal layer is matched with a crystal lattice of the tunnel barrier layer to form a cubic-on-cubic structure.
 5. The magnetoresistance effect element according to claim 1, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 6. The magnetoresistance effect element according to claim 1, wherein a magnetoresistance ratio is 100% or greater when applying a bias voltage of 1 V or higher at room temperature.
 7. The magnetoresistance effect element according to claim 1, wherein at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer has magnetic anisotropy perpendicular to a stacking direction.
 8. The magnetoresistance effect element according to claim 1, wherein at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer is Co₂Mn_(1-a)Fe_(a)Al_(b)Si_(1-b) (0≤a≤1, 0≤b≤1).
 9. The magnetoresistance effect element according to claim 2, wherein the tunnel barrier layer has a disordered spinel structure.
 10. The magnetoresistance effect element according to claim 2, wherein a crystal lattice of either or both of the first ferromagnetic metal layer and the second ferromagnetic metal layer is matched with a crystal lattice of the tunnel barrier layer to form a cubic-on-cubic structure.
 11. The magnetoresistance effect element according to claim 3, wherein a crystal lattice of either or both of the first ferromagnetic metal layer and the second ferromagnetic metal layer is matched with a crystal lattice of the tunnel barrier layer to form a cubic-on-cubic structure.
 12. The magnetoresistance effect element according to claim 9, wherein a crystal lattice of either or both of the first ferromagnetic metal layer and the second ferromagnetic metal layer is matched with a crystal lattice of the tunnel barrier layer to form a cubic-on-cubic structure.
 13. The magnetoresistance effect element according to claim 2, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 14. The magnetoresistance effect element according to claim 3, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 15. The magnetoresistance effect element according to claim 4, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 16. The magnetoresistance effect element according to claim 9, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 17. The magnetoresistance effect element according to claim 10, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 18. The magnetoresistance effect element according to claim 11, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2.
 19. The magnetoresistance effect element according to claim 12, wherein a composition ratio of the divalent cation and the Ga ion is within a range of 0.9 to 1.25:2. 